ZMD31020
Sensor Signal Conditioner
Datasheet
4. PACKAGE DIMENSIONS
SSOP14 (209mil = 5.3mm)
weight: ≤ 0.3g
package body material: low stress epoxy
lead material:
lead finish:
lead form:
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Dimensions of Sub-Group C1
Amin
1.73
0.05
A1min
A1max
A2min
A2max
cmin
0.21
1.68
1.78
0.09
0.20
6.07
6.33
5.20
5.38
0.25
Dimensions of Sub-Group B1
cmax
Amax
1.99
0.25
0.38
0.65
7.65
7.90
0.63
1.22
Dmin
*
Bpmin
bpmax
enom
Dmax
*
Emin
Emax
kmin
*
*
HEmin
HEmax
Lpmin
Zmax
θmin
0°
θmax
10°
* without mold-flesh
All dimensions in mm, reference: DIN EN 190000
Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19
15/19
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD [ Zentrum Mikroelektronik Dresden AG ]
