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PDSP16256A 参数 Datasheet PDF下载

PDSP16256A图片预览
型号: PDSP16256A
PDF下载: 下载PDF文件 查看货源
内容描述: 可编程FIR滤波器 [Programmable FIR Filter]
分类和应用:
文件页数/大小: 25 页 / 205 K
品牌: ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
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PDSP16256/A  
Test  
Waveform measurement level  
Delay from  
output high  
to output  
V
H
0·5V  
I
OL  
high impedance  
Delay from  
output low  
0·5V  
0·5V  
to output  
V
L
high impedance  
1·5V  
DUT  
30pF  
Delay from  
output high  
impedance to  
output low  
1·5V  
Delay from  
output high  
impedance to  
output high  
I
OH  
0·5V  
1·5V  
Three state delay measurement load  
VH is the voltage reached when the output is driven high  
VL is the voltage reached when the output is driven low  
Figure. 23 Three state delay measurement  
Absolute Maximum Ratings (Note 1)  
PDSP16256 MC AC1R and PDSP16256 MC GC1R  
(MIL-STD-883 PARTS)  
20·5V to 17·0V  
Supply voltage, VDD  
Polyimide is used as an inter-layer dielectric as  
glassification. Polymeric material meeting the  
requirements of MIL-STD-883 test method 5011 is used  
for die attach.  
20·5V to VDD 10·5V  
20·5V to VDD 10·5V  
Input voltage, VIN  
Output voltage, VOUT  
18mA  
500V  
265°C to1150°C  
Clamp diode current per pin, IK (see note 2)  
Static discharge voltage (HBM)  
Storage temperature, TS  
Maximum junction temperature, TJMAX  
Commercial grade  
Life tesst/burn-in connections are given in Tables 9 and  
10 on the following pages.  
1100°C  
1110°C  
1150°C  
3000mW  
Industrial grade  
Military grade  
Change Notification  
Package power dissipation  
Thermal resistance, Junction-to-Case, θJC  
5°C/W  
ThechangenotificationrequirementsofMIL-PRF-38535  
will be implemented on MIL-STD-883 grade devices.  
Known customers will be notified of any changes since  
the last buy when ordering further parts if significant  
changes have been made.  
NOTES  
1. Exceeding these ratings may cause permanent  
damage. Functional operation under these conditions  
is not implied.  
2. Maximum dissipation should not be exceeded for  
more than 1 second, only one output to be tested at  
any one time.  
Rev.  
Date  
A
B
C
D
MAR 1993 SEPT 1995 JAN 1998 AUG 1998  
3. Exposure to absolute maximum ratings for extended  
periods may affect device reliablity.  
4. Current is defined as negative into the device.  
5. The θJC data assumes that heat is extracted from the  
top of the package.  
6. Maximum junction temperature, TJMAX, is specified  
with power applied.  
22  
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