MIN
MAX
A
A1
A2
D
2.20
0.50
1.17 REF
39.80
2.46
0.70
40.20
D1
E
E1
b
e
34.50 REF
40.20
0.90
39.80
34.50 REF
E1
E
0.60
1.27
596
Conforms to JEDEC MS - 034
e
D
D1
A2
A
A1
b
NOTE:
1. CONTROLLING DIMENSIONS ARE IN MM
2. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
3. SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
4. N IS THE NUMBER OF SOLDER BALLS
5. NOT TO SCALE.
6. SUBSTRATE THICKNESS IS 0.56 MM
Package Code
Previous package codes:
ISSUE
ACN
DATE
APPRD.