MA808
AC TIMING CHARACTERISTICS (REFER TO FIGS. 10 AND 11)
Characteristic
Symbol
Min.
Set up time RXI to RCK (H L)
Set up time TSZ to RCK (H L)
Set up time
FRS
to LCK (H L)
Data hold time wrt RCK (H L)
TSZ (L) hold time wrt RCK (H L)
TSZ(H) hold time wrt RCK (H L)
FRS
hold time wrt LCK (H L)
Nominal frequency
Propagation delay, LCK to RXO1 and RXO2
Propagation delay, LCK (H L) to CK
Propagation delay, RCK (H L) to
CCR
(H L)
Propagation delay, RCK (L H) to
CCR
(L H)
Propagation delay, RCK (L H) to TSZ
Propagation delay, RCK (L H) to ER
Propagation delay, RCK (L H) to SA
Propagation delay, RCK (L H) to
Q8N-Q3N, Q1N and Q1S
t
SUD
t
SUTSO
t
SUR
t
HDD
t
HDTSOL
t
HDTSOH
t
HDR
f
t
PD
t
PC
t
PCCR1
t
PCCR2
t
PTSO
t
PER
t
PSA
t
PQ
25
20
150
100
50
100
150
2.048
30
0
0
0
20
20
20
20
150
175
150
200
200
200
200
200
Value
Typ.
Units
Max.
ns
ns
ns
ns
ns
ns
ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
Outputs loaded
to10pF,
f
CLOCK
=2.048MHz
ABSOLUTE MAXIMUM RATINGS
Supply voltage, V
DD
-V
SS
Voltage on any pin (V
IN
) (See note 1)
Current through any pin (See note 1)
Storage temperature
Operating temperature range
- 0.3 to + 7.0V
V
SS
- 0.3V to V
DD
+ 0.3V
±
20mA
-55°C to + 125°C
-10°C to+55°C
NOTES
1. Guaranteed no latch-up conditions.
2. Stresses above those listed in the Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these conditions, or at any other condition above those indicated
in the Electrical Characteristics, is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may
affect device reliability.
11
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
