Le78D11
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods can affect device reliability.
–60ºC < TA < +125ºC
Storage Temperature
Ambient Temperature, under Bias
Ambient relative humidity (non condensing)
-40ºC ≤ TA ≤ + 85ºC
5 to 95%
V
V
CCA with respect to DGND
CCA with respect to VCCD
–0.4 to + 4.0 V
–0.4 to + 0.4 V
VCCD with respect to DGND
AGND with respect to DGND
–0.4 to + 4.0 V
±50 mV
–0.4 to 5.5V or VCCD + 2.37 V, whichever is
smaller
5 V tolerant digital pins with respect to DGND
–0.4 to VCCD +0.4 V
±100 mA
Any other pin with respect to DGND
Latch up immunity (any pin)
Package Assembly
The standard (non-green) package devices are assembled with industry-standard mold compounds, and the leads possess a tin/
lead (Sn/Pb) plating. These packages are compatible with conventional SnPb eutectic solder board assembly processes. The
peak soldering temperature should not exceed 225°C during printed circuit board assembly.
The green package devices are assembled with enhanced environmental compatible lead (Pb), halogen, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
OPERATING RANGES
Zarlink guarantees the performance of this device over commercial (0° to 70°C) and industrial (−40° to 85°C)
temperature ranges by conducting electrical characterization over each range, and by conducting a production test
with single insertion coupled to periodic sampling. These characterization and test procedures comply with section
4.6.2 of Bellcore TR-TSY-000357 Component Reliability Assurance Requirements for Telecommunications
Equipment.
Environmental Ranges
Ambient Temperature
-40ºC ≤ TA ≤ + 85ºC
Ambient Relative Humidity
15 to 85%
Electrical Maximum Ranges
+3.3 V ± 5%
VCCD ± 50mV
Analog Supply VCCA
Digital Supply VCCD
+3.3 V ± 5%
0 V
DGND
AGND
±10 mV
5V Tolerant Digital Pins
DGND to +5.25V
ELECTRICAL CHARACTERISTICS
Power Dissipation
Description
Test Conditions
Two channels Standby
One channel Active, one channel Standby
Two channels Active
Min
Typ
100
140
180
Max
120
160
210
Unit
Le78D11 VoSLAC device Power
Dissipation
mW
13
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
