Le77D11
Data Sheet
PHYSICAL DIMENSIONS
44-Pin eTQFP
Min
-
Nom
Max
1.20
0.15
1.05
Min
0.09
0.45
Nom
-
Max
0.20
0.75
Symbol
A
Symbol
c
-
A1
A2
D
0.05
0.95
-
L
0.60
1.00 REF
-
1.00
L1
12 BSC
10 BSC
12 BSC
10 BSC
-
S
0.20
0.17
-
D1
E
b
0.20
0.80 BSC
8.00
8.00
0.20
0.20
0.10
0.20
44
0.27
e
E1
R2
R1
Ԧ
Ԧ 1
Ԧ 2
Ԧ 3
D2
E2
aaa
bbb
ccc
ddd
N
0.08
0.08
0.20
-
-
7 deg
-
0 deg
0 deg
3.5 deg
-
11 deg 12 deg 13 deg
11 deg 12 deg 13 deg
Notes:
1. Controlling dimension in millimeter unless otherwise specified.
2. Dimensions “D1” and “E1” do not include mold protrusion. Allowable protrusion is
0.25mm per side.
“D1” and “E1” are maximum plastic body size dimensions including mold mismatch.
3. Dimension “b” does not include Dambar protrusion. Allowable Dambar protrusion
shall not cause the lead width to exceed the maximum “b” dimension by more than 0.08mm.
4. Dambar can not be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm pitch packages.
5. Square dotted line is E-Pad outline.
6. “N” is the total number of terminals.
44-Pin eTQFP
Note:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
21
Zarlink Semiconductor Inc.
ZARLINK [ ZARLINK SEMICONDUCTOR INC ]
