Product specification
8
9
SERIES
0402
RC
Chip Resistor Surface Mount
TEST
TEST METHOD
IEC 60115-1 4.39
PROCEDURE
REQUIREMENTS
Intermittent
Overload
2.5 times of rated voltage or maximum
overload voltage whichever is less for 1 second
on and 25 seconds off; total 10,000 cycles
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Solderability
- Wetting
Well tinned (≥95% covered)
IPC/JEDEC J-STD-002B test B
Electrical Test not required
Magnification 50X
No visible damage
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: lead-free solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
IPC/JEDEC J-STD-002B test D
- Leaching
Lead-free solder, 260 °C, 30 seconds
immersion time
No visible damage
IEC 60068-2-58
- Resistance to
Soldering Heat
Condition B, no pre-heat of samples
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<50 mΩ for Jumper
Lead-free solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
www.yageo.com
Jan 05, 2011 V.6
YAGEO [ YAGEO CORPORATION ]
