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XC3S200-4PQG208C 参数 Datasheet PDF下载

XC3S200-4PQG208C图片预览
型号: XC3S200-4PQG208C
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内容描述: Spartan-3系列FPGA系列:完整的数据手册 [Spartan-3 FPGA Family: Complete Data Sheet]
分类和应用:
文件页数/大小: 198 页 / 1762 K
品牌: XILINX [ XILINX, INC ]
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R
Spartan-3 FPGA Family: Functional Description  
output voltage swing for all standards except GTL and  
GTLP.  
Table 4: Single-Ended I/O Standards (Values in Volts)  
VCCO  
Board  
All single-ended standards except the LVCMOS, LVTTL,  
and PCI varieties require a Reference Voltage (VREF) to  
bias the input-switching threshold. Once a configuration  
data file is loaded into the FPGA that calls for the I/Os of a  
given bank to use such a signal standard, a few specifically  
reserved I/O pins on the same bank automatically convert  
to VREF inputs. When using one of the LVCMOS standards,  
these pins remain I/Os because the VCCO voltage biases  
Signal  
Standard  
For  
For  
VREF for  
Termination  
Outputs Inputs Inputs(1) Voltage(VTT  
)
SSTL2_I  
SSTL2_II  
Notes:  
2.5  
2.5  
-
-
1.25  
1.25  
1.25  
1.25  
1. Banks 4 and 5 of any Spartan-3 device in a VQ100 package  
do not support signal standards using VREF  
.
2. The VCCO level used for the GTL and GTLP standards must  
be no lower than the termination voltage (VTT), nor can it be  
lower than the voltage at the I/O pad.  
the input-switching threshold, so there is no need for VREF  
.
Select the VCCO and VREF levels to suit the desired sin-  
gle-ended standard according to Table 4.  
3. See Table 6 for a listing of the single-ended DCI standards.  
Differential standards employ a pair of signals, one the  
opposite polarity of the other. The noise canceling (e.g.,  
Common-Mode Rejection) properties of these standards  
permit exceptionally high data transfer rates. This section  
introduces the differential signaling capabilities of Spartan-3  
devices.  
Table 5: Differential I/O Standards  
VCCO (Volts)  
VREF for  
Inputs  
(Volts)  
For  
For  
Inputs  
Signal Standard  
LDT_25 (ULVDS_25)  
LVDS_25  
Outputs  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
-
-
-
-
-
-
-
-
-
-
-
-
Each device-package combination designates specific I/O  
pairs that are specially optimized to support differential  
standards. A unique “L-number”, part of the pin name, iden-  
tifies the line-pairs associated with each bank (see Module  
4: Pinout Descriptions). For each pair, the letters “P” and  
“N” designate the true and inverted lines, respectively. For  
example, the pin names IO_L43P_7 and IO_L43N_7 indi-  
cate the true and inverted lines comprising the line pair L43  
on Bank 7. The VCCO lines provide current to the outputs.  
The VREF lines are not used. Select the VCCO level to suit  
the desired differential standard according to Table 5.  
BLVDS_25  
LVDSEXT_25  
LVPECL_25  
RSDS_25  
Notes:  
1. See Table 6 for a listing of the differential DCI standards.  
The need to supply VREF and VCCO imposes constraints on  
which standards can be used in the same bank. See The  
Organization of IOBs into Banks section for additional  
guidelines concerning the use of the VCCO and VREF lines.  
Table 4: Single-Ended I/O Standards (Values in Volts)  
VCCO  
Board  
Termination  
Digitally Controlled Impedance (DCI)  
Signal  
Standard  
For  
For  
VREF for  
When the round-trip delay of an output signal — i.e., from  
output to input and back again — exceeds rise and fall  
times, it is common practice to add termination resistors to  
the line carrying the signal. These resistors effectively  
match the impedance of a device’s I/O to the characteristic  
impedance of the transmission line, thereby preventing  
reflections that adversely affect signal integrity. However,  
with the high I/O counts supported by modern devices, add-  
ing resistors requires significantly more components and  
board area. Furthermore, for some packages — e.g., ball  
grid arrays — it may not always be possible to place resis-  
tors close to pins.  
Outputs Inputs Inputs(1) Voltage (VTT  
)
GTL  
Note 2  
Note 2  
1.5  
Note 2  
0.8  
1.2  
1.5  
0.75  
1.5  
0.9  
0.9  
1.8  
-
GTLP  
Note 2  
1
0.75  
0.9  
0.9  
0.9  
1.1  
-
HSTL_I  
-
-
HSTL_III  
1.5  
HSTL_I_18  
HSTL_II_18  
HSTL_III_18  
LVCMOS12  
LVCMOS15  
LVCMOS18  
LVCMOS25  
LVCMOS33  
LVTTL  
1.8  
-
1.8  
-
1.8  
-
1.2  
1.2  
1.5  
1.8  
2.5  
3.3  
3.3  
3.0  
-
1.5  
-
-
DCI answers these concerns by providing two kinds of  
on-chip terminations: Parallel terminations make use of an  
integrated resistor network. Series terminations result from  
controlling the impedance of output drivers. DCI actively  
adjusts both parallel and series terminations to accurately  
match the characteristic impedance of the transmission line.  
This adjustment process compensates for differences in I/O  
impedance that can result from normal variation in the  
ambient temperature, the supply voltage and the manufac-  
1.8  
-
-
2.5  
-
-
3.3  
-
-
3.3  
-
-
PCI33_3  
3.0  
-
-
SSTL18_I  
1.8  
0.9  
0.9  
DS099-2 (v1.3) August 24, 2004  
www.xilinx.com  
5
Preliminary Product Specification