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Virtex-II Platform FPGAs:
DC and Switching Characteristics
DS031-3 (v4.0) April 7, 2014
Product Specification
Virtex-II Electrical Characteristics
Virtex-II™ devices are provided in -6, -5, and -4 speed
grades, with -6 having the highest performance.
commercial device). However, only selected speed grades
and/or devices might be available in the industrial range.
Virtex-II DC and AC characteristics are specified for both
commercial and industrial grades. Except the operating
temperature range or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -4 speed
grade industrial device are the same as for a -4 speed grade
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parame-
ters included are common to popular designs and typical
applications. Contact Xilinx for design considerations
requiring more detailed information.
All specifications are subject to change without notice.
Virtex-II DC Characteristics
Table 1: Absolute Maximum Ratings
(1)
Symbol
VCCINT
VCCAUX
VCCO
Description
Internal supply voltage relative to GND
Units
–0.5 to 1.65
–0.5 to 4.0
V
V
Auxiliary supply voltage relative to GND
Output drivers supply voltage relative to GND
Key memory battery backup supply
–0.5 to 4.0
V
VBATT
–0.5 to 4.0
V
VREF
Input reference voltage
–0.5 to VCCO + 0.5
–0.5 to VCCO + 0.5
–0.5 to 4.0
V
(3)
VIN
Input voltage relative to GND (user and dedicated I/Os)
Voltage applied to 3-state output (user and dedicated I/Os)
Storage temperature (ambient)
V
VTS
V
TSTG
–65 to +150
°C
All regular FF/BF flip-chip and
FG/BG/CS wire-bond packages
+220
+250
°C
°C
Pb-free FGG456, FGG676, BGG575,
and BGG728 wire-bond packages
TSOL
Maximum soldering temperature(2)
Pb-free FGG256 and CSG144
wire-bond packages
+260
+125
°C
°C
TJ
Maximum junction temperature(2)
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. For soldering guidelines and thermal considerations, see the Device Packaging and Thermal Characteristics Guide information on the Xilinx
website.
3. Inputs configured as PCI are fully PCI compliant. This statement takes precedence over any specification that would imply that the device is not PCI
compliant.
© 2000–2014 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
DS031-3 (v4.0) April 7, 2014
Product Specification
www.xilinx.com
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