R
QPRO Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)
Ordering Information
XQR1701L CC44 M
Device Number
Operating Range/Processing
XQ1701L
XQR1701L
M = Military (T = –55° to +125°C)
C
Package Type
QML certified to MIL-PRF-38535
CC44 = 44-pin Ceramic Chip Carrier
SO20 = 20-pin Plastic Small Outline Package
N = Military Plastic (T = –55° to +125°C)
J
5962 9951401 Q Y A
Generic Standard
Lead Finish
Microcircuit Drawing
(SMD)
A = Solder Dip
B = Solder Plate
Device Type
Package Type
XQ1701L
Y
X
= 44-pin Ceramic Chip Carrier
= 20-pin Plastic Small Outline Package
QML Certified
Valid Ordering Combinations
XQ1701LCC44M
XQ1701LSO20N
XQR1701LCC44M
Revision History
The following table shows the revision history for this document.
Date
Version
1.0
Revision
04/20/00
06/01/00
Initial Release
2.0
Combined XQR1700L Rad-Hard and XQ1701L devices, added XQ1704L and updated
format.
02/08/01
3.0
Removed the XQ1704L and XQR1704L
10
www.xilinx.com
DS062 (v3.0) February 8, 2000
1-800-255-7778
Preliminary Product Specification
XILINX [ XILINX, INC ]
