R
XC3000 Series Field Programmable Gate Arrays
XC3000L Absolute Maximum Ratings
Symbol
Description
Supply voltage relative to GND
Units
V
V
–0.5 to +7.0
–0.5 to V +0.5
CC
V
Input voltage with respect to GND
Voltage applied to 3-state output
Storage temperature (ambient)
V
IN
CC
V
–0.5 to V +0.5
V
TS
CC
T
T
–65 to +150
+260
°C
°C
°C
°C
STG
SOL
Maximum soldering temperature (10 s @ 1/16 in.)
Junction temperature plastic
+125
T
J
Junction temperature ceramic
+150
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended
periods of time may affect device reliability.
XC3000L Global Buffer Switching Characteristics Guidelines
Speed Grade
Symbol
-8
Description
Max
Units
Global and Alternate Clock Distribution1
Either: Normal IOB input pad through clock buffer
to any CLB or IOB clock input
Or: Fast (CMOS only) input pad through clock
buffer to any CLB or IOB clock input
T
9.0
7.0
ns
ns
PID
T
PIDC
TBUF driving a Horizontal Longline (L.L.)1
I to L.L. while T is Low (buffer active)
T↓ to L.L. active and valid with single pull-up resistor
T↑ to L.L. High with single pull-up resistor
T
5.0
12.0
24.0
ns
ns
ns
IO
T
ON
T
PUS
BIDI
Bidirectional buffer delay
T
2.0
ns
BIDI
Notes: 1. Timing is based on the XC3042A, for other devices see timing calculator.
2. The use of two pull-up resistors per Longline, available on other XC3000 devices, is not a valid option for XC3000L devices.
7-48
November 9, 1998 (Version 3.1)
XILINX [ XILINX, INC ]
