1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) ............................................................................
Storage temperature range ............................................................................
Maximum power dissipation (PD)....................................................................
Lead temperature (soldering, 10 seconds).....................................................
Junction temperature (TJ) 2/...........................................................................
Thermal resistance, junction-to-case (ΘJC).....................................................
Input voltage range (VIL, VIH)..........................................................................
Data retention.................................................................................................
Endurance:
-0.3 V dc to +6.25 V dc
-65°C to +150°C
1.0 W
+300°C
+175°C
See MIL-STD-1835
-0.3 V dc to +6.25 V dc
10 years (minimum)
Types 01-04, 06, 07, 09-12, 14, 15 ..............................................................
Types 05, 08, 13 ,16.....................................................................................
Chip clear voltage (VH) ...................................................................................
10,000 cycles/byte (minimum)
100,000 cycles/byte (minimum)
15.0 V dc
1.4 Recommended operating conditions. 1/
Supply voltage range (VCC) ............................................................................
Case operating temperature range (TC) .........................................................
Input voltage, low range (VIL)..........................................................................
Input voltage, high range (VIH)........................................................................
+4.5 V dc to +5.5 V dc
-55°C to +125°C
-0.1 V dc to +0.8 V dc
+2.0 V dc to VCC +0.3 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
1/ All voltages are referenced to VSS (ground).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
SIZE
STANDARD
5962-88525
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
D
3
DSCC FORM 2234
APR 97
XICOR [ XICOR INC. ]
