Production Data
WM8945
PACKAGE DIMENSIONS
B: 36 BALL W-CSP PACKAGE 2.960 X 3.060 X 0.7mm BODY, 0.50 mm BALL PITCH
DM063.A
6
D
A
2
DETAIL 1
6
5
4
3
2
1
G
A2
A1
CORNER
A
B
4
5
e
C
D
E
F
E1
E
0.10
Z
2 X
e
TOP VIEW
DETAIL 2
2 X
0.10 Z
D1
BOTTOM VIEW
f1
f2
h
bbb
Z
1
Z
A1
DETAIL 2
Dimensions (mm)
Symbols
A
NOM
0.7
MIN
MAX
0.785
0.269
0.411
NOTE
0.615
0.219
0.244
A1
A2
0.361
0.386
2.960 BSC
2.500 BSC
3.060 BSC
2.500 BSC
0.500 BSC
D
D1
E
E1
e
5
f1
f2
0.220
0.270
0.035
g
h
0.070
0.105
0.314 BSC
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
PD, May 2011, Rev 4.1
167
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
