WM8253
Production Data
PACKAGE DIMENSIONS
DS: 20 PIN SSOP (7.2 x 5.3 x 1.75 mm)
DM0015.C
b
e
20
11
E1
E
GAUGE
PLANE
1
10
D
0.25
L
c
A1
A A2
L
1
-C-
C
0.10
SEATING PLANE
Dimensions
(mm)
NOM
-----
Symbols
MIN
-----
MAX
2.0
-----
1.85
0.38
0.25
7.50
A
A1
A2
b
c
D
e
E
E1
L
0.05
1.65
0.22
0.09
6.90
-----
1.75
0.30
-----
7.20
0.65 BSC
7.80
7.40
5.00
0.55
8.20
5.60
0.95
5.30
0.75
L1
1.25 REF
0o
4o
8o
-
JEDEC.95, MO 150
REF:
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.20MM.
D. MEETS JEDEC.95 MO-150, VARIATION = AE. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
PD, Rev 4.1, August 2011
25
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
