WM8181
Advanced Information
PACKAGE DIMENSIONS
DM019.A
DW: 16 PIN SOICW 7.5mm (0.3") Wide Body, 1.27mm Lead Pitch
e
B
16
9
E
H
L
1
8
D
h x 45o
A1
SEATING PLANE
-C-
α
A
C
0.10 (0.004)
Dimensions
(mm)
Dimensions
(Inches)
Symbols
MIN
MAX
2.65
0.30
0.51
0.32
10.50
MIN
MAX
A
A1
B
C
D
e
2.35
0.10
0.33
0.23
10.10
0.0926
0.0040
0.0130
0.0091
0.3465
0.1043
0.0118
0.0200
0.0125
0.3622
1.27 BSC
0.0500 BSC
E
h
H
L
7.40
0.25
10.00
0.40
0o
7.60
0.75
10.65
1.27
8o
0.2914
0.0100
0.3940
0.0160
0o
0.2992
0.0290
0.4190
0.0500
8o
α
REF:
JEDEC.95, MS-013
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-013, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
AI Rev 3.0 January 2000
14
WOLFSON MICROELECTRONICS LTD
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
