Typical Characteristics (Continued)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
※Notes :
0.9
1. V = 0 V
2. IDG=S 250 µ A
※Notes :
1. V = 10 V
2. IDG=S 1.0 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
T, Junction Temperature [oC]
T, Junction Temperature [oC]
J
J
Figure 7. Breakdown Voltage Variation
vs Temperature
Figure 8. On-Resistance Variation
vs Temperature
2.0
1.6
1.2
0.8
0.4
0.0
Operation in This Area
is Limited by R DS(on)
101
100 µs
1 ms
10 ms
100
DC
-1
10
※Notes :
1. TC = 25 oC
2. T = 150 o
C
J
3. Single Pulse
-2
10
100
101
102
103
25
50
75
100
125
150
TC, Case Temperature [℃]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
D = 0 .5
100
※
N otes
1.
:
Z
(t) = 2.32 ℃ /W M ax.
2. DθuJtCy Factor, D =t1/t2
0 .2
0 .1
3. TJM
-
TC
=
PDM * Zθ JC(t)
0 .0 5
10-1
0 .02
PDM
0 .01
t1
sin g le p ulse
t2
10-2
10-5
10-4
10-3
10-2
10-1
100
101
t1, S quare W ave P ulse D uration [sec]
Figure 11. Transient Thermal Response Curve
WISDOM [ WISDOM TECHNOLOGIES INT`L ]
