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W25X40BV 参数 Datasheet PDF下载

W25X40BV图片预览
型号: W25X40BV
PDF下载: 下载PDF文件 查看货源
内容描述: 1M位, 2M位和4M位串行闪存4KB扇区和双I / O SPI [1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI]
分类和应用: 闪存
文件页数/大小: 51 页 / 1636 K
品牌: WINBOND [ WINBOND ]
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W25X10BV/20BV/40BV  
9.2.20 Read Manufacturer / Device ID (90h)  
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down/  
Device ID instruction that provides both JEDEC assigned manufacturer ID and the specific device ID.  
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device  
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code  
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond  
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first  
as shown in figure 21. The Device ID values for the W25X10BV/20BV/40BV are listed in Manufacturer  
and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be  
read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read  
continuously, alternating from one to the other. The instruction is completed by driving /CS high.  
Figure 21. Read Manufacturer / Device ID Diagram  
Publication Release Date: August 20, 2009  
- 33 -  
Preliminary -- Revision B  
 
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