W25Q20BW
10. PACKAGE SPECIFICATION
10.1 8-Pin SOIC 150-mil (Package Code SN)
8
5
c
E H
E
L
1
D
4
0.25
θ
A
Y
SEATING PLANE
b
e
A1
GAUGE PLANE
SYMBOL
A
A1
b
c
(3)
E
(3)
D
(2)
e
H
E
(4)
Y
L
MILLIMETERS
Min
1.35
0.10
0.33
0.19
3.80
4.80
1.27 BSC
5.80
---
0.40
0°
6.20
0.10
1.27
10°
0.228
---
0.016
0°
INCHES
Min
0.053
0.004
0.013
0.008
0.150
0.188
0.050 BSC
0.244
0.004
0.050
10°
Max
1.75
0.25
0.51
0.25
4.00
5.00
Max
0.069
0.010
0.020
0.010
0.157
0.196
θ
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
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