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W25Q20BWSNIP 参数 Datasheet PDF下载

W25Q20BWSNIP图片预览
型号: W25Q20BWSNIP
PDF下载: 下载PDF文件 查看货源
内容描述: 具有双路和四路SPI 1.8V 2M位串行闪存 [1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI]
分类和应用: 闪存
文件页数/大小: 70 页 / 2014 K
品牌: WINBOND [ WINBOND ]
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W25Q20BW  
8.2.35 Read JEDEC ID (9Fh)  
For compatibility reasons, the W25Q20BW provides several instructions to electronically determine the  
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI  
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin  
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)  
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the  
falling edge of CLK with most significant bit (MSB) first as shown in figure 33. For memory type and  
capacity values refer to Manufacturer and Device Identification table.  
Figure 33. Read JEDEC ID Instruction Sequence  
Publication Release Date: January 25, 2011  
- 53 -  
Preliminary - Revision B  
 
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