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W25Q128BV 参数 Datasheet PDF下载

W25Q128BV图片预览
型号: W25Q128BV
PDF下载: 下载PDF文件 查看货源
内容描述: 具有双路和四路SPI 3V 128M位串行闪存 [3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI]
分类和应用: 闪存
文件页数/大小: 74 页 / 756 K
品牌: WINBOND [ WINBOND ]
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W25Q128BV  
7.2.35 Read JEDEC ID (9Fh)  
For compatibility reasons, the W25Q128BV provides several instructions to electronically determine the  
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI  
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low  
and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and  
two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling  
edge of CLK with most significant bit (MSB) first as shown in Figure 33. For memory type and capacity  
values refer to Manufacturer and Device Identification table.  
/CS  
Mode 3  
Mode 0  
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15  
CLK  
Instruction (9Fh)  
High Impedance  
DI  
(IO0)  
Manufacturer ID (EFh)  
DO  
(IO1)  
= MSB  
*
/CS  
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30  
Mode 3  
Mode 0  
CLK  
DI  
(IO0)  
Memory Type ID15-8  
Capacity ID7-0  
DO  
(IO1)  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
*
*
Figure 33. Read JEDEC ID Instruction Sequence  
Publication Release Date: April 01, 2011  
Revision E  
- 55 -  
 
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