W25Q16DV
3.7 Ball Configuration TFBGA 8x6-mm
Figure 1e. W25Q16DV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB or TC)
3.8 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
CLK
I/O
FUNCTION
B2
B3
I
Serial Clock Input
Ground
GND
B4
VCC
Power Supply
Chip Select Input
C2
/CS
I
C4
/WP (IO2)
DO (IO1)
DI (IO0)
/HOLD (IO3)
NC
I/O
I/O
I/O
I/O
Write Protect Input (Data Input Output 2)*2
Data Output (Data Input Output 1)*1
Data Input (Data Input Output 0)*1
Hold Input (Data Input Output 3)*2
No Connect
D2
D3
D4
Multiple
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
Publication Release Date: October 29, 2012
Revision D
- 9 -
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