ISD5100 – SERIES
12.5 ISD5108 DIE INFORMATION
VSSD
SDA
A0
SCL
A1
V
INT
RAC
VSSA
VSSD
VCCD CCDXCLK
ISD5108 Device
Die Dimensions (include scribe line)
X: 4230 µm
Y: 6090 µm
Die Thickness [3]
ISD5108
292.1 µm ± 12.7 µm
≈
≈
Pad Opening
Single pad: 90 x 90 µm
Double pad: 180 x 90 µm
VSSA
AUX OUT
AUX IN
[2]
MIC -
ANA OUT +
ANA OUT -
SP -
VCCA
SP +
ANA IN
[2]
MIC +
ACAP
VSSA
Notes
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or
damage may occur.
2.
3.
Double bond recommended, if treated as single doubled-pad.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change in
the future.
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