ISD5100 – SERIES
12.7 ISD5102 DIE INFORMATION
VCCD
VCCD XCLK
VSSD
SDA
A0
SCL
A1
INT
RAC
VSSA
VSSD
ISD5102 Device
Die Dimensions (include scribe line)
X: 4230 µm
Y: 5046 µm
ISD5102
≈
≈
Die Thickness [3]
292.1 µm ± 12.7 µm
Pad Opening
Single pad: 90 x 90 µm
Double pad: 180 x 90 µm
VSSA
MIC +
[2]
AUX OUT
AUX IN
MIC -
ANA OUT -
SP -
V
ANA IN
SP + CCA
[2]
ANA OUT +
ACAP
VSSA
Notes
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or
damage may occur.
2.
3.
Double bond recommended, if treated as single doubled-pad.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change in
the future.
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