BRIGHT
Microelectronics
Inc.
Preliminary BM29F400T/BM29F400B
PACKAGE DIMENSIONS
PSOP44
44-pin Small Outline Package (measured in millimeters)
23
44
0.10
0.21
.060
1.00
15.70
16.30
13.10
13.50
1
22
1.27 NOM.
0
8
28.00
28.40
2.17
2.45
2.80
MAX.
Seating Plane
0.10
0.35
0.35
0.50
TSOP48
48-Pin Standard Thin Small Outline Package (measured in millimeters)
0.95
1.05
Pin 1 I.D.
1
48
11.90
12.10
0.50 BSC
24
25
0.05
0.15
18.30
18.50
19.80
20.20
0.08
0.20
0.10
0.21
1.20
MAX
0
5
0.25MM(0.0098)BSC
.050
.070
A Winbond Company
Publication Release Date: May 1999
Revision A1
- 37 -
WINBOND [ WINBOND ]
