欢迎访问ic37.com |
会员登录 免费注册
发布采购

29F400B-12TI 参数 Datasheet PDF下载

29F400B-12TI图片预览
型号: 29F400B-12TI
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 512KX8, 120ns, PDSO48, TSOP-48]
分类和应用: 光电二极管内存集成电路
文件页数/大小: 38 页 / 227 K
品牌: WINBOND [ WINBOND ]
 浏览型号29F400B-12TI的Datasheet PDF文件第30页浏览型号29F400B-12TI的Datasheet PDF文件第31页浏览型号29F400B-12TI的Datasheet PDF文件第32页浏览型号29F400B-12TI的Datasheet PDF文件第33页浏览型号29F400B-12TI的Datasheet PDF文件第34页浏览型号29F400B-12TI的Datasheet PDF文件第36页浏览型号29F400B-12TI的Datasheet PDF文件第37页浏览型号29F400B-12TI的Datasheet PDF文件第38页  
BRIGHT  
Microelectronics  
Inc.  
Preliminary BM29F400T/BM29F400B  
ORDERING INFORMATION  
PART NO.  
ACCESS  
TIME  
POWER  
SUPPLY  
CURRENT  
MAX. (mA)  
BOOT PACKAGE CYCLING  
TEMPERATURE  
RANGE  
BLOCK  
(MIN.)  
(nS)  
29F400T-90PC  
29F400T-12PC  
29F400T-90TC  
29F400T-12TC  
29F400B-90PC  
29F400B-12PC  
29F400B-90TC  
29F400B-12TC  
29F400T-90PI  
29F400T-12PI  
29F400T-90TI  
29F400T-12TI  
29F400B-90PI  
29F400B-12PI  
29F400B-90TI  
29F400B-12TI  
90  
120  
90  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
60  
Top  
Top  
44SOP  
44SOP  
48TSOP  
48TSOP  
44SOP  
44SOP  
48TSOP  
48TSOP  
44SOP  
44SOP  
48TSOP  
48TSOP  
44SOP  
44SOP  
48TSOP  
48TSOP  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
10,000  
0°C - 70°C  
0°C - 70°C  
0°C - 70°C  
Top  
0°C - 70°C  
120  
90  
Top  
0°C - 70°C  
Bottom  
Bottom  
Bottom  
Bottom  
Top  
0°C - 70°C  
120  
90  
0°C - 70°C  
0°C - 70°C  
120  
90  
-40°C - 85°C  
-40°C - 85°C  
-40°C - 85°C  
-40°C - 85°C  
-40°C - 85°C  
-40°C - 85°C  
-40°C - 85°C  
-40°C - 85°C  
120  
90  
Top  
Top  
120  
90  
Top  
Bottom  
Bottom  
Bottom  
Bottom  
120  
90  
120  
Notes:  
1. Winbond reserves the right to make changes to its products without prior notice.  
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in  
applications where personal injury might occur as a consequence of product failure.  
3. Typical Program/Erase Cycle is 100,000.  
A Winbond Company  
Publication Release Date: May 1999  
Revision A1  
- 35 -  
 复制成功!