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25M02GVTCIG 参数 Datasheet PDF下载

25M02GVTCIG图片预览
型号: 25M02GVTCIG
PDF下载: 下载PDF文件 查看货源
内容描述: [3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS]
分类和应用:
文件页数/大小: 68 页 / 820 K
品牌: WINBOND [ WINBOND ]
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W25M02GV  
4. PIN DESCRIPTIONS  
4.1 Serial MCP (SpiStack®) Device Configuration  
W25N01GV  
W25N01GV  
IO0 (DIO)  
IO1 (DO)  
/CS  
CLK  
IO2 (/WP)  
IO3 (/HOLD)  
Die #0  
W25M02GV (SpiStack®)  
Figure 2a. W25M02GV Device Configuration  
All signal pins are shared by the stacked dies within the package. Each die is assigned a “Die ID#” in the  
factory. Only a single die is active at any given time, and have the control of the SPI bus to communicate  
with the external SPI controller. However, all the dies will accept two instructions regardless their Active or  
Idle status: 1) “Software Die Select (C2h)” instruction; it is used to set any single die to be active according  
to the 8-bit Die ID following the instruction. 2) “Device Reset (FFh)” instruction; it is used to reset all the  
stacked dies to their power-up state. Die #0 will always be Active after power-up or Device Reset.  
4.2 Chip Select (/CS)  
The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is  
deselected and the Serial Data Output (DO, or IO0, IO1, IO2, IO3) pins are at high impedance. When  
deselected, the devices power consumption will be at standby levels unless an internal erase, program or  
write status register cycle is in progress. When /CS is brought low the device will be selected, power  
consumption will increase to active levels and instructions can be written to and data read from the device.  
After power-up, /CS must transition from high to low before a new instruction will be accepted. The /CS  
input must track the VCC supply level at power-up and power-down (see “Write Protection” and Figure  
30b). If needed, a pull-up resistor on the /CS pin can be used to accomplish this.  
4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)  
The W25M02GV supports standard SPI, Dual SPI and Quad SPI operation. Standard SPI instructions use  
the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the rising  
edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to read  
data or status from the device on the falling edge of CLK.  
Dual and Quad SPI instructions use the bidirectional IO pins to serially write instructions, addresses or  
data to the device on the rising edge of CLK and read data or status from the device on the falling edge of  
CLK.  
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