WILLAS
Power MOSFET 200 mAmps, 50 Volts
200V
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V-
SOD-123
•
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
•
Low profile surface mounted application in order to
optimize board space.
•
Low power loss, high efficiency.
•
High current capability, low forward voltage drop.
•
High surge capability.
Typical applications are dc–dc converters, power management in
•
Guardring for overvoltage protection.
portable and battery–powered products such as computers, printers,
•
Ultra high-speed switching.
PCMCIA cards, cellular and cordless telephones.
•
Silicon epitaxial planar chip, metal silicon junction.
Low Threshold Voltage (V
GS(th)
: 0.5V...1.5V) makes it ideal for low
•
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
voltage applications
•
RoHS product for packing code suffix "G"
Miniature SOT–23 Surface Mount Package saves board space
Halogen free product for packing code suffix "H"
FM120-M
THRU
BSS 8LT1
FM1200-M
Pb Free Product
PACKAGE
Features
Package outline
SOD-123H
N–Channel SOT–23
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
•
•
Mechanical
is available
•
Pb-Free package
data
•
Epoxy : UL94-V0
packing code suffix
RoHS product for
rated flame retardant
”G”
•
Case :
free product
SOD-123H
Halogen
Molded plastic,
for packing code suffix “H”
,
•
Terminals :Plated terminals, solderable per MIL-STD-750
Method 2026
0.040(1.0)
0.024(0.6)
SOT –23
0.031(0.8) Typ.
0.031(0.8) Typ.
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
N - Channel
3
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
1
For capacitive load, derate current by 20%
RATINGS
Marking Code
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
o
MARKING DIAGRAM
& PIN ASSIGNMENT
SYMBOL
FM120-M
H FM130-MH
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
UNIT
2
M
V
RRM
V
RMS
V
DC
I
O
I
FSM
Symbol
R
ΘJA
V
DSS
C
J
V
GS
T
J
12
20
14
20
13
30
21
30
14
40
28
40
15
50
35
50
16
60
42
60
1.0
30
18
80
56
80
J1
70
10
100
100
115
150
105
150
120
200
140
200
Volts
Volts
Volts
Amps
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
MAXIMUM RATINGS (T
A
= 25 C unless otherwise noted)
J1 = Device Code
M = Month Code
Amps
℃/W
PF
℃
℃
UNIT
Volts
mAmps
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
Rating
Value
50
±
20
Unit
Vdc
Drain–to–Source Voltage
Gate–to–Source Voltage – Continuous
Operating Temperature Range
Drain Current
Storage Temperature Range
Vdc
-55 to +125
40
120
ORDERING INFORMATION
-55 to +150
– Continuous @ TA = 25°C
– Pulsed Drain Current (tp
≤
10
µs)
CHARACTERISTICS
I
DM
I
D
TSTG
SYMBOL
mA
Shipping
200
BSS138LT1
SOT–23
3000 Tape & Reel
800
FM120-MH
FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH
FM1150-MH
FM1200-MH
225
– 55 to
150
556
260
mW
0.50
°C
°C/W
°C
0.70
0.5
10
0.85
0.9
0.92
-
65
to
Device
+175
Package
Maximum
Power Dissipation @ TA
DC
Total
Forward Voltage at 1.0A
= 25°C
P
D
V
F
Maximum Average Reverse Current at @T A=25℃
T T
Operating and Storage Temperature
I
J, stg
R
@T A=125℃
Rated
Range
DC Blocking Voltage
Thermal Resistance – Junction–to–Ambient
NOTES:
Purposes, for
From Junction
2- Thermal Resistance
10 seconds
to Ambient
R
θJA
1- Measured at 1 MHZ
Temperature for Soldering
4.0 VDC.
Maximum Lead
and applied reverse voltage of
T
L
2012-06
WILLAS ELECTRONIC CORP.
2012-10
WILLAS ELECTRONIC CORP.