SCA61T Series
4.2 Reflow Soldering
The SCA61T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 17.
Recommended SCA61T body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Profile feature
Sn-Pb Eutectic
Assembly
Pb-free Assembly
Average ramp-up rate (TL to TP)
Preheat
3°C/second max.
3°C/second max.
-
-
-
Temperature min (Tsmin
)
100°C
150°C
150°C
Temperature max (Tsmax
Time (min to max) (ts)
)
200°C
60-120 seconds
60-180 seconds
3°C/second max
Tsmax to T, Ramp up rate
Time maintained above:
-
-
Temperature (TL)
Time (tL)
183°C
217°C
60-150 seconds
240 +0/-5°C
60-150 seconds
250 +0/-5°C
Peak temperature (TP)
Time within 5°C of actual Peak Temperature (TP)
Ramp-down rate
10-30 seconds
6°C/second max
6 minutes max
20-40 seconds
6°C/second max
8 minutes max
Time 25° to Peak temperature
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
•
•
Preheating time and temperatures according to solder paste manufacturer.
It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
Wave soldering is not recommended.
Ultrasonic cleaning is not allowed. The sensing element may be damaged by ultrasonic
cleaning process.
•
•
VTI Technologies Oy
www.vti.fi
Subject to changes
Doc. nr. 8261900
17/18
Rev.A
VTI [ VTI TECHNOLOGIES ]
