SCA61T Series
3.2 Recommended Printed Circuit Board Footprint
Figure 15.
Recommended PCB footprint
4
Mechanical Specifications and Reflow Soldering
4.1 Mechanical Specifications (Reference only)
Lead frame material:
Plating:
Solderability:
RoHS compliance:
Co-planarity error
The part weights
Copper
Nickel followed by Gold
JEDEC standard: JESD22-B102-C
RoHS compliant lead free component.
0.1mm max.
<1 g
Figure 16. Mechanical dimensions of the SCA61T. (Dimensions in mm)
VTI Technologies Oy
www.vti.fi
Subject to changes
Doc. nr. 8261900
16/18
Rev.A
VTI [ VTI TECHNOLOGIES ]
