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VSC8117QP1 参数 Datasheet PDF下载

VSC8117QP1图片预览
型号: VSC8117QP1
PDF下载: 下载PDF文件 查看货源
内容描述: ATM / SONET / SDH 155分之622 Mb / s的收发器复用/解复用,集成时钟发生器和时钟恢复 [ATM/SONET/SDH 622/155 Mb/s Transceiver Mux/Demux with Integrated Clock Generation and Clock Recovery]
分类和应用: 时钟发生器ATM集成电路SONET集成电路SDH集成电路电信集成电路电信电路异步传输模式
文件页数/大小: 22 页 / 408 K
品牌: VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
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VITESSE  
SEMICONDUCTOR CORPORATION  
Data Sheet  
ATM/SONET/SDH 622/155 Mb/s Transceiver Mux/Demux  
with Integrated Clock Generation and Clock Recovery  
VSC8117  
Package Thermal Characteristics  
The VSC8117 is packaged into a thermally-enhanced plastic quad flatpack (PQFP). This package adheres  
to the industry-standard EIAJ footprint for a 10x10mm body but has been enhanced to improve thermal dissipa-  
tion with the inclusion of an exposed Copper Heat Spreader. The package construction is as shown in Figure 10.  
Figure 11: Package Cross Section  
Copper Heat Spreader  
Insulator  
Lead  
Wire Bond  
Plastic Molding Compound  
Die  
The thermal resistance for the VSC8117 package is improved through low thermal resistance paths from  
the die to the exposed surface of the heat spreader and from the die to the lead frame through the heat spreader  
overlap of the lead frame.  
Table 16: 64-Pin PQFP Thermal Resistance  
Symbol  
Description  
Thermal resistance from junction to case  
Value  
Units  
oC/W  
2.5  
θjc  
Thermal resistance from case to ambient in still air including conduction through  
the leads for a non-thermally saturated board.  
θca  
37  
oC/W  
θca-100  
θca-200  
θca-400  
θca-600  
Thermal resistance from case to ambient in 100 LPFM air  
Thermal resistance from case to ambient in 200 LPFM air  
Thermal resistance from case to ambient in 400 LPFM air  
Thermal resistance from case to ambient in 600 LPFM air  
31  
28  
24  
22  
oC/W  
oC/W  
oC/W  
oC/W  
o
The VSC8117QB1 is designed to operate at a maximum case temperature of up to 115 C. The user must guar-  
antee that the maximum case temperature specification is not violated. Given the thermal resistance of the pack-  
age in still air, the user can operate the VSC8117QB1 in still air if the ambient temperature does not exceed  
o
o
o
o
55 C (55 C = 115 C - 1.6W * 37 C/W). If operation above this ambient temperature is required, then an appro-  
priate heatsink must be used with the part or adequate airflow must be provided.  
Page 18  
VITESSE SEMICONDUCTOR CORPORATION  
G52221-0, Rev 4.1  
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896  
1/8/00  
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