VSC7984
Datasheet
PACKAGE INFORMATION
A significant advantage of the VSC7984 device is its small plastic package. VSC7984YF is a 24-pin, plastic quad flat
no-lead (QFN) package with an exposed pad, 4 mm × 4 mm body size, 0.65 mm body thickness, 0.5 mm pin pitch,
and 1 mm maximum height. The device is also available in a lead(Pb)-free package, VSC7984XYF.
Lead(Pb)-free products from Vitesse comply with the temperatures and profiles defined in the joint IPC and JEDEC
standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
The backside of the die is mounted directly to a heat spreader with conductive epoxy. The exposed heat spreader must
be connected to the most negative power supply (typically –5 V) or must be left floating.
The primary heat path is through the exposed heat spreader on the bottom of the package. Some heat can be removed
through the top of the package; however, it is recommended to thermally connect the exposed heat spreader to the
PCB. Contact your local Vitesse sales representative for detailed information about the PCB design.
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VMDS-10029 Revision 4.1
January 19, 2007
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
