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BCM400P500M1K8A30 参数 Datasheet PDF下载

BCM400P500M1K8A30图片预览
型号: BCM400P500M1K8A30
PDF下载: 下载PDF文件 查看货源
内容描述: [Fixed Ratio DC-DC Converter]
分类和应用:
文件页数/大小: 25 页 / 3145 K
品牌: VICOR [ VICOR CORPORATION ]
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BCM400x500y1K8A3z  
Input and Output Filter Design  
Thermal Considerations  
A major advantage of SAC™ systems versus conventional PWM  
converters is that the transformer based SAC does not require external  
filtering to function properly. The resonant LC tank, operated at  
extreme high frequency, is amplitude modulated as a function of input  
voltage and output current and efficiently transfers charge through the  
isolation transformer. A small amount of capacitance embedded in the  
primary and secondary stages of the module is sufficient for full  
functionality and is key to achieving power density.  
The ChiP package provides a high degree of flexibility in that it presents  
three pathways to remove heat from internal power dissipating  
components. Heat may be removed from the top surface, the bottom  
surface and the leads. The extent to which these three surfaces are  
cooled is a key component for determining the maximum power that is  
available from a ChiP, as can be seen from Figure 1.  
Since the ChiP has a maximum internal temperature rating, it is  
necessary to estimate this internal temperature based on a real thermal  
solution. Given that there are three pathways to remove heat from the  
ChiP, it is helpful to simplify the thermal solution into a roughly  
equivalent circuit where power dissipation is modeled as a current  
source, isothermal surface temperatures are represented as voltage  
sources and the thermal resistances are represented as resistors. Figure  
19 shows the “thermal circuit” for a VI Chip® BCM module 6123 in an  
application where the top, bottom, and leads are cooled. In this case,  
the BCM power dissipation is PDTOTAL and the three surface  
temperatures are represented as TCASE_TOP, TCASE_BOTTOM, and TLEADS. This  
thermal system can now be very easily analyzed using a SPICE  
simulator with simple resistors, voltage sources, and a current source.  
The results of the simulation would provide an estimate of heat flow  
through the various pathways as well as internal temperature.  
This paradigm shiꢀ requires system design to carefully evaluate  
external filters in order to:  
nGuarantee low source impedance:  
To take full advantage of the BCM module’s dynamic  
response, the impedance presented to its input terminals  
must be low from DC to approximately 5 MHz. The  
connection of the bus converter module to its power  
source should be implemented with minimal distribution  
inductance. If the interconnect inductance exceeds  
100 nH, the input should be bypassed with a RC damper  
to retain low source impedance and stable operation. With  
an interconnect inductance of 200 nH, the RC damper  
may be as high as 1 μF in series with 0.3 Ω. A single  
electrolytic or equivalent low-Q capacitor may be used in  
place of the series RC bypass.  
Thermal Resistance Top  
MAX INTERNAL TEMP  
1.33°C / W  
nFurther reduce input and/or output voltage ripple without  
Thermal Resistance Bottom  
Thermal Resistance Leads  
1.29°C / W  
5.64°C / W  
sacrificing dynamic response:  
+
+
+
Given the wide bandwidth of the module, the source  
response is generally the limiting factor in the overall  
system response. Anomalies in the response of the source  
will appear at the output of the module multiplied by its  
K factor.  
TCASE_BOTTOM(°C)  
TLEADS(°C)  
TCASE_TOP(°C)  
Power Dissipation (W)  
Figure 19 Top case, Bottom case and leads thermal model  
nProtect the module from overvoltage transients imposed  
by the system that would exceed maximum ratings and  
induce stresses:  
Alternatively, equations can be written around this circuit and  
analyzed algebraically:  
The module primary/secondary voltage ranges shall not be  
exceeded. An internal overvoltage lockout function  
prevents operation outside of the normal operating input  
range. Even when disabled, the powertrain is exposed  
to the applied voltage and power MOSFETs must  
withstand it.  
TINT – PD1 • 1.24 = TCASE_TOP  
TINT – PD2 • 1.24 = TCASE_BOTTOM  
TINT – PD3 • 7 = TLEADS  
PDTOTAL = PD1+ PD2+ PD3  
Where TINT represents the internal temperature and PD1, PD2, and PD3  
represent the heat flow through the top side, bottom side, and leads  
respectively.  
Total load capacitance at the output of the BCM module shall not  
exceed the specified maximum. Owing to the wide bandwidth and low  
output impedance of the module, low-frequency bypass capacitance  
and significant energy storage may be more densely and efficiently  
provided by adding capacitance at the input of the module. At  
frequencies <500 kHz the module appears as an impedance of RSEC  
between the source and load.  
Thermal Resistance Top  
MAX INTERNAL TEMP  
1.33°C / W  
Thermal Resistance Bottom  
Thermal Resistance Leads  
Within this frequency range, capacitance at the input appears as  
effective capacitance on the output per the relationship  
defined in Eq. (13).  
1.29°C / W  
5.64°C / W  
+
+
TCASE_BOTTOM(°C)  
TLEADS(°C)  
TCASE_TOP(°C)  
Power Dissipation (W)  
CPRI_EXT  
(13)  
CSEC_EXT  
=
K2  
Figure 20 Top case and leads thermal model  
This enables a reduction in the size and number of capacitors used in a  
typical system.  
BCM® Bus Converter  
Page 21 of 25  
Rev 1.4  
07/2015  
vicorpower.com  
800 927.9474  
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