BCM352x125y300A00
Recommended Heat Sink Push Pin Location
(NO GROUNDING CLIPS)
(WITH GROUNDING CLIPS)
Notes:
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) Minimum recommended pitch is 39.50 (1.555).
This provides 7.00 (0.275) component
edge-to-edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pitch is 41.00 (1.614).
This provides 8.50 (0.334) component
edge-to-edge spacing, and 2.00 (0.079)
clearance between Vicor heat sinks.
3. VI Chip® module land pattern shown for reference
only; actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all full-size VI Chip® products.
x.x (x.xx) = 0.3 (0.01)
x.xx (x.xxx) = 0.13 (0.005)
4. RoHS compliant per CST–0001 latest revision.
6. Plated through holes for grounding clips (33855)
shown for reference, heat sink orientation and
device pitch will dictate final grounding solution.
BCM® Bus Converter
Page 20 of 21
Rev 2.0
08/2016
vicorpower.com
800 927.9474
VICOR [ VICOR CORPORATION ]
