PRELIMINARY
V•I Chip Bus Converter Module
V•I Chip soldering recommendations
Removal and rework
V•I Chip modules are intended for reflow soldering processes. The
following information defines the processing conditions required for
successful attachment of a V•I Chip to a PCB. Failure to follow the
recommendations provided can result in aesthetic or functional failure
of the module.
V•I Chip modules can be removed from PCBs using special tools such
as those made by Air-Vac. These tools heat a very localized region of
the board with a hot gas while applying a tensile force to the
component (using vacuum). Prior to component heating and removal,
the entire board should be heated to 80-100ºC to decrease the
component heating time as well as local PCB warping. If there are
adjacent moisture-sensitive components, a 125ºC bake should be used
prior to component removal to prevent thermal damage and avoid the
“popcorning” phenomenon. V•I Chip modules should not be expected
to survive a removal operation.
Storage
V•I Chip modules are currently rated at MSL 5. Exposure to ambient
conditions for more than 48 hours requires a 24 hour bake at 125ºC to
remove moisture from the package.
Solder paste stencil design
239
Solder paste is recommended for a number of reasons, including
overcoming minor solder sphere co-planarity issues as well as simpler
integration into overall SMD process.
Joint Temperature, 220ºC
Case Temperature, 208ºC
183
165
63/37 SnPb, either no-clean or water-washable, solder paste should be
used. Pb-free development is underway.
The recommended stencil thickness is 6 mils. The apertures should be
0.9:1.
degC
91
Pick and place
Modules should be placed within 5 mils.to maintain placement
position, the modules should not be subjected to acceleration greater
than 500 in/sec2 prior to reflow.
16
Soldering Time
Reflow
Figure 25 — Thermal profile diagram
There are two temperatures critical to the reflow process; the solder
joint temperature and the module’s case temperature. The solder joint’s
temperature should reach at least 220ºC, with a time above liquidus
(183ºC) of ~30 seconds.
The module’s case temperature must not exceed 208 ºC at anytime
during reflow.
Because of the ΔT needed between the pin and the case, a forced-air
convection oven is preferred for reflow soldering. This reflow method
generally transfers heat from the PCB to the solder joint. The module’s
large mass also reduces its temperature rise. Care should be taken to
prevent smaller devices from excessive temperatures. Reflow of
modules onto a PCB using Air-Vac-type equipment is not recommended
due to the high temperature the module will experience.
Inspection
The solder joints should conform to IPC 12.2
• Properly wetted fillet must be evident.
• Heel fillet height must exceed lead thickness plus solder thickness.
Figure 26 — Properly reflowed V•I Chip J-Lead
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B384F120T24
Rev. 1.2
Page 12 of 13
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