PRELIMINARY
V•I Chip Bus Converter Module
Specifications (continued)
General
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
2.6
Mhrs
25°C, GB
4,242
10
Vdc
pF
Input to Output
Capacitance
500
Input to Output
Resistance
MΩ
Input to Output
Agency approvals (pending)
cTÜVus
UL/CSA 60950, EN 60950
Low Voltage Directive
See mechanical drawing, Figures 15
CE Mark
Mechanical
Weight
0.50/14
oz/g
Dimensions
Length
1.26/32
0.87/22
0.25/6,3
in/mm
in/mm
in/mm
Width
Height
Thermal
Over temperature shutdown
Thermal capacity
125
130
0.61
1.1
135
°C
Junction temperature
Ws/°C
°C/W
°C/W
°C/W
Junction-to-case thermal impedance (RθJC)
Junction-to-board thermal impedance (RθJB)
Junction-to-ambient
2.1
5.0
With 0.25” heat sink, see Figure 20
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
Note
Primary control (PC)
DC voltage
4.8
2.4
5.0
2.5
2.5
2.5
150
17
5.2
Vdc
Vdc
Vdc
mA
ms
Module disable voltage
Module enable voltage
Current limit
2.6
2.9
2.4
Source only
Enable delay time
Disable delay time
µs
See Figure 12, time from PC low to output low
Figure 12 — VOUT at full load vs. PC disable
Figure 13 — PC signal during fault
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B384F120T24
Rev. 1.2
Page 5 of 13
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