PRELIMINARY
Mechanical Drawings
V•I Chip Bus Converter Module
1,00
0.039
SOLDER BALL
#A1 INDICATOR
18,00
0.709
9,00
0.354
1,00
0.039
SOLDER BALL #A1
21,5
0.85
5,9
0.23
0.020
(106) X Ø 0.51
SOLDER BALL
1,00
TYP
0.039
OUTPUT
30,00
1.181
INPUT
INPUT
OUTPUT
32,0
1.26
28,8
1.13
16,0
0.63
C
L
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
0.06
C
L
BOTTOM VIEW
1,00
0.039
3,9
0.15
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
15,6
0.62
SEATING PLANE
Figure 15—
BCM BGA mechanical outline; Inboard mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
(ø
0,51
)
0.020
0,50
0.020
1,50
0.059
( 1,00 )
0.039
ø 0,53 PLATED VIA
0.021
CONNECT TO
INNER LAYERS
SOLDER MASK
DEFINED PADS
0,50
0.020
( 1,00 )
0.039
1,00
0.039
9,00
0.354
1
18,00
0.709
1,00
0.039
1,00
0.039
SOLDER PAD #A1
(2) X 10,00
0.394
+IN
(4) X 6,00
0.236
+OUT1
-OUT1
RECOMMENDED LAND AND VIA PATTERN
TM
(COMPONENT SIDE SHOWN)
PCB CUTOUT
RSV
29,26
1.152
24,00
0.945
16,00
0.630
8,00
0.315
0,37
0.015
1,6
(4) X R 0.06
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
20,00
0.787 17,00
0.669 15,00 13,00
0.591
0.512
+OUT2
-IN
PC
31
-OUT2
(106) X ø
0,51
0.020
8,08
0.318
16,16
0.636
SOLDER MASK
DEFINED PAD
Figure 16—BCM
BGA PCB land/VIA layout information; Inboard mounting
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K480T30
Rev. 1.5
Page 8 of 15
VICOR [ VICOR CORPORATION ]
