PRELIMINARY
Configuration Options
V•I Chip Bus Converter Module
Configuration
Effective power density
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
Inboard
(1)
(Package K)
1750 W/in
3
2.1 °C/W
1.1 °C/W
Onboard
(1)
(Package F)
1090 W/in
3
2.4 °C/W
1.1 °C/W
Inboard with 0.25"
Heatsink
680 W/in
3
2.1 °C/W
N/A
Onboard with 0.25"
Heatsink
550 W/in
3
2.4 °C/W
N/A
6.5 °C/W
6.8 °C/W
5.0 °C/W
5.0 °C/W
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
21.5
0.85
22.0
0.87
32.0
1.26
32.0
1.26
4.0
0.16
6.3
0.25
INBOARD MOUNT
(V•I Chip recessed into PCB)
mm
in
ONBOARD MOUNT
mm
in
Figure 19—Inboard
mounting – package K
Figure 20—
Onboard mounting – package F
Input reflected ripple
measurement point
F1
10 A
Fuse
+In
Enable/Disable Switch
+Out
+
R3
5 mΩ
C3
9.4 µF
C1
47 µF
electrolytic
SW1
R2
2 kΩ
TM
RSV
PC
BCM
K
Ro
-Out
Load
D1
-In
+Out
-Out
–
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
Figure 21—BCM
test circuit
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K480T30
Rev. 1.5
Page 10 of 15
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