PRELIMINARY
Specifications
Thermal
Symbol
Parameter
Over temperature shutdown
Thermal capacity
R
θJC
R
θJB
R
θJA
R
θJA
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient
(1)
Junction-to-ambient
(2)
(continued)
V•I Chip Bus Converter Module
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
BGA package
Notes:
(1 B048K480T30 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) B048K480T30 with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
V•I Chip Stress Driven Product Qualification Process
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Highly Accelerated Life Testing (HALT)
Dynamic cycling
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
(1)
Per Vicor internal
test specification
(1)
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20°C to 125°C
Note:
(1) For details of the test protocols see Vicor’s website.
V•I Chip Ball Grid Array Interconnect Qualification
T
est
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K480T30
Rev. 1.5
Page 6 of 15
VICOR [ VICOR CORPORATION ]
