AIM1714xB6MC7D5yzz
General Characteristics
Specifications apply over all line and load conditions, 50Hz and 60Hz line frequencies, TC = 25°C, unless otherwise noted.
Boldface specifications apply over the temperature range of the specified Product Grade.
Attribute
Symbol
Conditions / Notes
Mechanical
Min
Typ
Max
Unit
Length
L
W
H
44.6 / [1.76]
35.5 / [1.40]
9.3 / [0.37]
14.5 / [0.88]
35 / [1.2]
mm / [in]
mm / [in]
mm / [in]
cm3/ [in3]
g / [oz]
Width
Height
Volume
Vol
M
Without heatsink
Mass (Weight)
Pin Material
Underplate
C145 copper, half hard
Low stress ductile nickel
Palladium
50
0.8
100
6
µin
µin
µin
Pin Finish
Soft Gold
0.12
2
Thermal
C-Grade
T-Grade
-20
-40
100
100
°C
°C
Operating Case Temperature
TC
Thermal Resistance,
Junction to Case Bottom
RJC_BOT
2.2
°C/W
Thermal Design
See Thermal Considerations on Page 10
Soldering
See: AN:401 PCB Mount
VIA Soldering Guidelines
Temperature
Reliability
MIL-HDBK-217FN2 Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer
8.2
MTBF
Telcordia Issue 2 - Method I Case III;
25°C
MHrs
28.6
7.4
MIL-HDBK-217FN2 - 25°C Ground
Benign, Stationary, Indoors / Computer
Safety
Agency Approvals / Standards
Dielectric Withstand (Hipot)
EN60950-1; CE marked for low voltage directive and RoHS recast directive, as applicable
IN / OUT to Case
1500
VAC
No Y capacitor connection of GND
connection within package
Leakage Current / Touch Current
Negligible
EMI/EMC Compliance
FCC Part 15, EN55022, CISPR22: 2006 +
A1: 2007, Conducted Emissions
Class B Limits - with VIA PFM –OUT
connected to GND
Level 3, Immunity Criteria A with PFM in
a VIA Package with external TMOV and
fuse, shown on page 2 or 3, required.
EN61000-4-5: 2006,
Surge Immunity
AIM™ in a VIA Package
Page 8 of 14
Rev 1.2
08/2017
VICOR [ VICOR CORPORATION ]
