X band High Power Amplifier
Bonding recommendations
Port
IN
OUT
Vd1, Vd2
Vg1R, Vg2R
CHA7114
Connection
Inductance (Lbonding) = 0.3nH
2 gold wires bondings (550 µm max)
Inductance (Lbonding) = 0.3nH
2 gold wires bondings (550 µm max)
Inductance
≤
1nH
Inductance
≤
1nH
External capacitor
C1 ~ 100pF
C1 ~ 100pF
C2 ~ 10nF
Assembly recommendations (drain voltage pulsed mode operation)
Vg
Vd
IN
OUT
Vg
Vd
C1=100pF
C2=10nF
Vg: gate supply voltage
Vd: drain supply voltage
Ref : DSCHA7114-7347 - 13 Dec 07
7/8
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
