CHA3693-QDG
20-30GHz Medium Power Amplifier
The RF ports are DC blocked on chip. The DC connections do not include any decoupling
capacitor in package, therefore it is mandatory to provide a good external DC decoupling on
the PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Definition of the Sij reference planes
The reference planes are defined from the footprint of the recommended characterization
board 95541 shown below.
The reference is the symmetrical axis of the package. The input and output reference planes
are located at 3.18mm offset (input wise and output wise respec.) from this axis. Then, the
given Sij incorporates this land pattern.
3.1
8
3.1
8
Unit : mm
Ref.: DSCHA3693-QDG7268 - 25 Sep 07
8/10
Specifications subject to change without notice
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