6-17GHz Low Noise Amplifier
Chip Assembly and Mechanical Data
Vd1, Vd2 DC drain supply feed
CHA3666
10nF
120pF
120pF
P1
N2
P2
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad position
DC Pads size: 100/100µm, Chip thickness: 100µm
Ref. : DSCHA36666159 - 08 Jun 06
7/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09