TQP3M9006
High Linearity LNA Gain Block
Mechanical Information
Package Information and Dimensions
This package is lead-free/RoHS-compliant.
The plating material on the leads is annealed
matte tin. It is compatible with both lead-
free (maximum 260 °C reflow temperature)
and lead (maximum 245 °C reflow
TriQuint
temperature) soldering processes.
9006
The component will be marked with a
“9006” designator with an alphanumeric lot
code on the top surface of package.
YYWW
aXXXX
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
Data Sheet: Rev C 05/26/11
- 8 of 9 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
© 2011 TriQuint Semiconductor, Inc.
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
