TQM8M9077
0.05-4 GHz Digital Variable Gain Amplifier
Mechanical Information
Package Information & Dimensions
Marking: Part number - TQM8M9077
Year, week, country code - YYWW CCCC
Assembly code – AaXXXX
.10
C
2X
TERMINAL #1
IDENTIFIER
5.0 0.1
4
32X 0.50 Pitch
0.25
32X 0.10
(32X) 0.450x X 0.240y
0.10
TERMINAL #1
IDENTIFIER
C
A B
1.90
4.50
5.0 0.1
TQM8M9077
YYWW CCC
AaXXXX
0.25
1.90
0.20
(1X) shape
0.10
C
A B
.10
C
2X
1.90
1.90
5
4.50
GND/THERMAL PAD
.10
C
C
1.02 0.08
.08
5
32X
SEATING PLANE
C
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B
(Variation DAE) for extra thin profile, fine pitch, internal stacking module (ISM).
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.
6. Contact plating: Electrolytic plated Au over Ni
PCB Mounting Pattern
25X
PACKAGE
OUTLINE
3
28X 0.28
0.50 PITCH
0.12
1
28X 0.75
3.70
0.76
0.38
0.66
3.70
COMPONENT SIDE
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
5. Place mounting screws near the part to fasten a back side heat sink.
6. Do not apply solder mask to the back side of the PC board in the heat sink contact region.
7. Ensure that the backside via region makes good physical contact with the heat sink.
Datasheet: Rev D 01-20-12
© 2012 TriQuint Semiconductor, Inc.
Disclaimer: Subject to change without notice
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