TQM8M9077
0.05-4 GHz Digital Variable Gain Amplifier
Pin Description
Pin #
1
Symbol
Ampin
Description
Amp RF input
2, 3, 13, 28, 30, 31, 32
GND (Ground)
NC (No Connect)
Ampout
ATTin
DC ground
11, 15, 16, 18-24
No electrical connection. Provide land pads for PCB mounting integrity.
29
Amp RF output / DC supply
12
DSA Input
4
ATTout
ACG1-6
SOD
DSA Output
5, 6, 7, 8, 9, 10
Place external capacitor to Ground for applications below 700 MHz.
14
17
25
26
27
Serial Data Out
Vdd
DC supply
CLK
Serial Clock
SID
Serial Data In
LE
Latch Enable
RF/DC ground. Provide recommended via pattern (see page 8) and ensure
good solder attach for best thermal and electrical performance.
Backside Paddle
RF/DC Ground
Applications Information
PC Board Layout
PCB Material (stackup):
1 oz. Cu top layer
0.014 inch Nelco N-4000-13 (εr=3.7 typ.)
1 oz. Cu middle layer 1
Core Nelco N-4000-13
1 oz. Cu middle layer 2
0.014 inch Nelco N-4000-13
1 oz. Cu bottom layer
Finished board thickness is 0.062 .006 inches
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary
from company to company, careful process development
is recommended.
Datasheet: Rev D 01-20-12
Disclaimer: Subject to change without notice
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© 2012 TriQuint Semiconductor, Inc.
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