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TGA4819-SL 参数 Datasheet PDF下载

TGA4819-SL图片预览
型号: TGA4819-SL
PDF下载: 下载PDF文件 查看货源
内容描述: 10.7GB / s的线性光调制器驱动 [10.7Gb/s Linear Optical Modulator Driver]
分类和应用: 驱动
文件页数/大小: 11 页 / 386 K
品牌: TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
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Advance Product Datasheet  
April 6, 2006  
TGA4819-SL  
Assembly of a TGA4819-SL Package onto a Motherboard  
Manual Assembly for Prototypes  
1. Clean the motherboard with Acetone and rinse with alcohol and DI water. Allow the motherboard to fully dry.  
2. Using a standard SN63 or lead-free solder paste, dispense solder paste dots of 5 to 15 mil in diameter to the  
motherboard. Assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each  
solder paste area and the closest edge of the ground pad.  
3. Manually place a TGA4819-SL on the motherboard with correct orientation and good alignment. The  
alignment can be determined manually by centering the package on the motherboard. The RF traces (pin 1 and  
pin 10) are located along the center horizontal axis of the package.  
4. Reflow the assembly on a hot plate with the surface temperature of the plate near 230 oC for 5 to 6 seconds  
(for SnPb).  
5. Let the assembly completely cool down. This package has little or no tendency to self- align during the reflow.  
6. Clean the assembly with acetone and rinse with alcohol and DI water.  
Typical Solder Reflow Profiles  
Reflow Profile  
SnPb  
Pb Free  
Ramp-up Rate  
3 °C/sec  
3 °C/sec  
Activation Time and  
Temperature  
60 – 120 sec @ 140 – 160 °C  
60 – 150 sec  
60 – 180 sec @ 150 – 200 °C  
60 – 150 sec  
Time above Melting Point  
Max Peak Temperature  
240 °C  
260 °C  
Time within 5 °C of Peak  
10 – 20 sec  
10 – 20 sec  
Temperature  
Ramp-down Rate  
4 – 6 °C/sec  
4 – 6 °C/sec  
CAUTION: The TGA4819-SL contains GaAs MMIC devices that are susceptible to damage from  
Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.  
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TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com