Advance Product Datasheet
April 6, 2006
TGA4819-SL
Mechanical Drawing
.350
.326
10
11
12
13
14
15
16
17
9
19
18
.175
Orientation Mark
8
7
6
5
4
3
2
1
.024
.000
Bond Pad #1 N/C
Bond Pad #2 N/C
Bond Pad #3 N/C
Bond Pad #4 N/C
Bond Pad #5 N/C
Bond Pad #6 VG
Bond Pad #7 N/C
Bond Pad #8 N/C
0.025" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.020" x 0.018"
0.018" x 0.041"
Bond Pad #11 N/C
Bond Pad #12 VD
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.018" x 0.041"
0.020" x 0.018"
0.334" x 0.187"
Bond Pad #13
N/C
Bond Pad #14 N/C
Bond Pad #15 N/C
VD_BYP
VCTRL
RF In
Bond Pad #16
Bond Pad #17
Bond Pad #18
Bond Pad #19
GND
Bond Pad #9 RF Out
Bond Pad #10 N/C
NOTES:
1. Maximize number of vias on attachment area of PCB for Bond Pad #19. This is required
electrical and thermal conduction
2. Pad sizes for RF input and output (#18, #9) are shown for soldermask opening. Solder
should not be applied outside of this area.
Dimensions: Inches
Tolerances: Length & Width: ±0.003"
Height: ±0.006"
Adjacent Pad to Pad Spacing: ±0.0002"
Pad Size: ±0.001"
Package Backside Material: Material: RO4003 (0.008" thk) w/ 0.5oz Cu (0.0007" thk)
Plating: 100 - 350µin Ni underplate w/ 5 - 10µin Au overplate
10
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