TGA4543
40.5 - 43.5 GHz Power Amplifier
Product Compliance Information
ESD Information
Solderability
Compatible with both lead-free (260 °C max.
reflow temp.) and tin/lead (245 °C max. reflow
temp.) soldering processes.
ESD Rating: Class 0
Value:
Test:
Standard:
Passes 150V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
RoHS Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain
Hazardous Substances in Electrical and
Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Assembly Notes
Component placement and adhesive attachment assembly notes:
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Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment (i.e. epoxy) can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
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Use AuSn (80/20) solder and limit exposure to temperatures above 300C to 3-4 minutes,
maximum.
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An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
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Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Data Sheet: Rev – 9/15/12
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Disclaimer: Subject to change without notice
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