TGA4543
40.5 - 43.5 GHz Power Amplifier
Mechanical Information
14
13
12
11
10
9
8
1
7
2
3
4
5
6
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
2, 14
3, 4, 5, 11, 12, 13 Vd
6, 10
7
8
9
Symbol
RF In
Vg
Pad Size
0.190 x 0.090
0.090 x 0.090
0.093 x 0.090
0.093 x 0.190
0.190 x 0.090
0.090 x 0.090
0.090 x 0.090
Vd
RF Out
Vdet
Vref
Preliminary Data Sheet: Rev – 9/15/12
- 11 of 12 -
Disclaimer: Subject to change without notice
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