GA1086
Layout Guidelines
through-holes connect this small surface plane to an
inner-layer ground plane. The capacitors (C1–C5) are
0.1 mF. TriQuint’s test board uses X7R temperature-
stable capacitors in 1206 SMD cases.
Multiple ground and power pins on the GA1086 reduce
ground bounce. Good layout techniques, however, are
necessary to guarantee proper operation and to meet
the specifications across the full operating range.
TriQuint recommends bypassing each of the VDD supply
pins to the nearest ground pin, as close to the chip as
possible.
Figure 13. Top Layer Layout of Power Pins
(Approx. 3.3x)
V
V
DD
DD
C4
C3
Pin 1
Figure 13 shows the recommended power layout for
the GA1086. The bypass capacitors should be located
on the same side of the board as the GA1086. The VDD
traces connect to an inner-layer VDD plane. All of the
ground pins (GND) are connected to a small ground
plane on the surface beneath the chip. Multiple
Ground
Plane
V
DD
C2
Ordering Information
Pin 15
To order, please specify as shown below:
C1
C5
V
V
DD
DD
GA1086-MC n...n
11-Output Clock Buffer
Propagation delay skew:
500 –350 ps ± 500 ps
1000 –350 ps ± 1000 ps
Additional Information
For latest specifications, additional product
information, worldwide sales and distribution locations,
and information about TriQuint:
Temperature range:
Web: www.triquint.com
Email: sales@tqs.com
Tel: (503) 615-9000
Fax: (503) 615-8900
0 °C to 70 °C (Commercial)
Package: MQuad
For technical questions and additional information on
specific applications:
Email: applications@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or
omissions. TriQuint assumes no responsibility for the use of this information, and all such information
shall be entirely at the user's own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1997 TriQuint Semiconductor, Inc. All rights reserved.
Revision 1.1.A
November 1997
12
For additional information and latest specifications, see our website: www.triquint.com
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